{"id":55410,"date":"2024-02-02T11:05:06","date_gmt":"2024-02-02T11:05:06","guid":{"rendered":"https:\/\/news.pakistaninewspaperlist.com\/alchip-technologies-demonstrates-ic-ecosystem-at-chiplet-summit\/"},"modified":"2024-02-02T11:05:06","modified_gmt":"2024-02-02T11:05:06","slug":"alchip-technologies-demonstrates-ic-ecosystem-at-chiplet-summit","status":"publish","type":"post","link":"https:\/\/pakistaninewspaperlist.com\/news\/alchip-technologies-demonstrates-ic-ecosystem-at-chiplet-summit\/","title":{"rendered":"Alchip Technologies Demonstrates IC Ecosystem at Chiplet Summit"},"content":{"rendered":"
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Santa Clara, CA, Feb. 02, 2024 (GLOBE NEWSWIRE) — Ecosystem collaboration will be the key strategy to overcome the functional scaling, time-to-market, and economic challenges of heterogeneous chiplet integration, according to Alchip Technologies.<\/p>\n

In a paper presented at Chiplet Summit on February 6th<\/sup>, Alchip urged semiconductor ecosystem collaboration to seamlessly integrate the strengths of the entire supply chain to extend the boundaries of Moore\u2019s law.<\/p>\n

The ASIC leader demonstrated a model for collaboration in the paper on a critical level, the integration of silicon-proven IP into a MCM and 2.5D\/3D manufacturing platform, featuring Alchip\u2019s AI\/High-Performance advanced packaging.<\/p>\n

The collaboration includes many features, such as architecture and simulation\/ verification reports, and early PPA, SI\/PI and power\/thermal evaluations.<\/p>\n

The paper, entitled \u201cAccelerate IO & Memory Chiplet Design for Multi-Die Systems\u201d was presented by industry-veterans Erez Shaizaf, Alchip\u2019s Chief Technology Officer.<\/p>\n

Mr. Shaizaf focuses on system technology solutions, based on 25-years of experience in VLSI, hardware, and system engineering. He has performed numerous successful silicon reticle tape-outs, on advanced technology nodes and high-speed interfaces.<\/p>\n

\u201cSwitching from monolithic SoCs to multi-die systems creates many cost, time-to-market, and heterogeneous die integration challenges. Companies must partner and get ready in advance to provide essential technologies at fast time-to-market and expertise that designers can leverage to meet requirement,\u201d Mr. Shaizaf explained.\u00a0<\/p>\n

Chiplet Summit Participation<\/u><\/p>\n

The Chiplet Summit is being held February 6-8 at the Santa Clara Convention Centers and covers the latest architectures, development platforms and methods, and applications. Expert panels will discuss best choices, as well as likely breakthroughs and long-term trends.<\/p>\n

Alchip is making available presentations and technical material at its booth in the Summit\u2019s exhibition hall.\u00a0 The material highlights the company\u2019s high-performance ASIC capabilities, including its industry-leading advances in advanced packaging technology, flexible engagement model, and advanced technology track record.<\/p>\n

\u201cAlchip works with an entire value chain to deliver leading edge advance packaging and process capabilities required by today\u2019s high-performance computing ASIC market. Chiplet Summit promotes chiplet technology that revolutionize the way we develop leading-edge devices. We are leading this emerging technology,\u201d explained Dave Hwang, Senior Vice President, Business Development and Marketing at Alchip.<\/p>\n

For more information about Alchip, go to www.alchip.com<\/a><\/p>\n

For more information about Chiplet Summit, go to chipletsummit.com<\/u><\/a><\/p>\n

About Alchip<\/strong><\/p>\n

Alchip Technologies Ltd., founded in 2003 and headquartered in Taipei, Taiwan, is a leading global provider of silicon and design and production services for system companies developing complex and high-volume ASICs and SoCs. Alchip provides faster time-to-market and cost-effective solutions for SoC design at mainstream and advanced process technology. Alchip has built its reputation as a high-performance ASIC leader through its advanced 2.5D\/3DIC design, CoWoS\/chiplet design and manufacturing management. <\/b>Customers include global leaders in AI, HPC\/supercomputer, mobile phones, entertainment device, networking equipment and other electronic product categories. Alchip is listed on the Taiwan Stock Exchange (TWSE: 3661).\u00a0<\/p>\n

About Chiplet Summit<\/b><\/p>\n

Chiplet Summit showcases the emerging chiplets market. It features the trends and people leading the adoption of this new technology in designing a wide variety of extremely large integrated chips. The Summit is a product of Semper Technologies.<\/p>\n