{"id":103053,"date":"2025-12-29T13:24:05","date_gmt":"2025-12-29T13:24:05","guid":{"rendered":"https:\/\/pakistaninewspaperlist.com\/news\/syntiant-expands-ndp115-portfolio-with-new-ewlb-and-ultra-thin-packages-bringing-advanced-edge-ai-to-ultra-compact-devices\/"},"modified":"2025-12-29T13:24:05","modified_gmt":"2025-12-29T13:24:05","slug":"syntiant-expands-ndp115-portfolio-with-new-ewlb-and-ultra-thin-packages-bringing-advanced-edge-ai-to-ultra-compact-devices","status":"publish","type":"post","link":"https:\/\/pakistaninewspaperlist.com\/news\/syntiant-expands-ndp115-portfolio-with-new-ewlb-and-ultra-thin-packages-bringing-advanced-edge-ai-to-ultra-compact-devices\/","title":{"rendered":"Syntiant Expands NDP115 Portfolio with New eWLB and Ultra-Thin Packages, Bringing Advanced Edge AI to Ultra-Compact Devices"},"content":{"rendered":"
\n

IRVINE, Calif., Dec. 29, 2025 (GLOBE NEWSWIRE) — Syntiant Corp., the recognized leader in ultra-low-power edge AI deployment, today announced two new package options for its NDP115 Neural Decision Processor\u2122, extending the chip\u2019s reach into devices that demand highly efficient layouts and exceptionally compact form factors across consumer, industrial and healthcare markets.<\/p>\n

Powered by Syntiant\u2019s Core 2\u2122 inference engine, the NDP115 runs speech inferences at just 280\u202f\u00b5W (microwatts) and is designed to natively execute multiple deep neural networks across architectures such as CNNs, RNNs and fully connected networks. Ideal for advanced AI-based environmental noise reduction, close-talk and far-field speech, keyword detection and audio event classification, the NDP115 also supports I\u00b2C and pulse density modulation (PDM) interfaces for sensor fusion, including multi-axis acceleration, tilt, magnetic field and pressure sensing.<\/p>\n

eWLB Package Streamlines Two-Layer PCB Designs<\/strong><\/p>\n

The new embedded wafer-level ball grid array (eWLB) package for the NDP115 is optimized for two-layer printed circuit board (PCB) designs, providing customers with a cost-efficient, high-performance solution for integrating edge AI into high-volume consumer electronics such as voice-enabled smart remotes, streaming devices and other smart home products.<\/p>\n

Ultra-Thin Package Expands Possibilities for Hearing Aids and Micro-Wearables<\/strong><\/p>\n

Syntiant\u2019s new ultra-thin NDP115 package is designed for hearing aids, earbuds and other space-constrained wearables. With a maximum height of just 0.31 mm, achieved by reducing the ball diameter to 130 \u03bcm (micrometers) and wafer thickness to 180 \u03bcm, the compact NDP115 package is enabling next-generation intelligence in the tiniest devices.<\/p>\n

\u201cAs manufacturers look to integrate always-on intelligence into a wider range of products, Syntiant is enhancing the NDP115 portfolio with packaging options that diversify design choices,\u201d said Nathan Nunley, product line director for NDP Hardware at Syntiant. \u201cFrom consumer devices requiring streamlined PCB designs to wearable health tech requiring the thinnest form factor possible, the NDP115 packages enable our customers to design smarter, smaller and more efficient products that deliver advanced edge AI for voice and sound processing, without compromising comfort, battery life or cost.\u201d<\/p>\n

Availability<\/strong>
Both the eWLB and ultra-thin NDP115 packages are available now. For more information, visit www.syntiant.com\/ndp115<\/a>.<\/p>\n

CES 2026<\/strong>
Syntiant will showcase its latest full-stack innovations at the Venetian Toscana Suite 3805\/3806 in Las Vegas, January 6\u20139. Contact info@syntiant.com<\/u><\/a> to schedule a demo of the company\u2019s\u00a0latest\u00a0sensor and\u00a0edge AI solutions.\u00a0<\/p>\n

About Syntiant<\/strong>
Founded in 2017 and headquartered in Irvine, Calif., Syntiant\u00ae is Making Edge AI a Reality\u2122 by delivering highly efficient processor, sensor, and software solutions. With more than 100 million purpose-built silicon and ML models deployed, along with billions of MEMS microphones and sensors, Syntiant\u2019s technology is powering edge AI applications for speech, audio, sensor and vision processing worldwide. From earbuds to automobiles, the company\u2019s turnkey solutions enable advanced edge AI capabilities across diverse consumer and industrial use cases. More information on the company can be found by\u00a0visiting\u202fwww.syntiant.com<\/u><\/a>\u202for by following\u00a0Syntiant\u00a0on X\u00a0@Syntiantcorp<\/u><\/a>\u202for\u202fLinkedIn<\/u><\/a>.<\/p>\n

Contact:<\/strong><\/p>\n

George Medici\/Natalie Mu
PondelWilkinson<\/a>
gmedici@pondel.com\/nmu@pondel.com
310.279.5980\u00a0<\/p>\n

\n <\/div>\n","protected":false},"excerpt":{"rendered":"

IRVINE, Calif., Dec. 29, 2025 (GLOBE NEWSWIRE) — Syntiant Corp., the recognized leader in ultra-low-power edge AI deployment, today announced two new package options for its NDP115 Neural Decision Processor\u2122, extending the chip\u2019s reach into devices that demand highly efficient layouts and exceptionally compact form factors across consumer, industrial and healthcare markets. 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