Austin, June 12, 2025 (GLOBE NEWSWIRE) — The wafer processing equipment market size was valued at USD 9.71 billion in 2024 and is expected to reach USD 14.84 billion by 2032, growing at a CAGR of 5.51% over the forecast period of 2025–2032. As semiconductor applications are increasing in next-gen technologies from artificial intelligence, smart devices, to autonomous vehicles the wafer processing equipment market is benefitting tremendously. The increasing demand for improved chip performance, power efficiency, and miniaturization is forcing manufacturers to sink more money into advanced fabrication tools.
The U.S. wafer processing equipment market was valued at USD 1.75 billion in 2024 and is projected to reach USD 2.92 billion by 2032, expanding at a CAGR of 6.65%. Key drivers include the country’s renewed focus on domestic semiconductor manufacturing through policy incentives and the establishment of next-gen fabs by industry giants like Intel and TSMC.
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Key Players:
- Applied Materials Inc.
- ASML Holding Semiconductor Company
- Tokyo Electron Limited
- Lam Research Corporation
- KLA Corporation
- DISCO
- Hitachi Kokusai Linear
- KLA Corporation
- Lam Research Corporation
- Motorola Solutions, Inc.
Wafer Processing Equipment Market Report Scope:
| Report Attributes | Details |
| Market Size in 2024 | USD 9.71 Billion |
| Market Size by 2032 | USD 14.84 Billion |
| CAGR | CAGR of 5.51% From 2025 to 2032 |
| Base Year | 2024 |
| Forecast Period | 2025-2032 |
| Historical Data | 2021-2023 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
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Deposition Technology, Sensor Integration, and Computing Innovation, Drive Segmental Leadership in the Wafer Processing Equipment Market
By Product
In 2024, the deposition segment emerged as the dominant product category in the wafer processing equipment market, capturing approximately 28.58% of the total revenue. This increase in growth can be mainly credited to the rise in the use of CVD and ALD technologies. This is critical for the formation of thin, uniform, and high-quality material layers on semiconductor wafers, particularly at smaller process nodes such as 5nm and 3nm. With an increase in chip sub-structures and layers to create, deposition tools provide the precision engineering demanded for leading-edge logic and memory devices, sustaining the ongoing demand in semiconductor fabrication.
By Application
The sensors segment accounted for nearly 40% of the wafer processing equipment market in 2024, making it the leading application area. Increasing demand for sensors in smart devices, industrial automation, wearable technology and automotive ADAS (Advanced Driver Assistance Systems) are all particularly driving growth in this segment. Processing tools are crucial for the fabrication of miniature, highly-selective sensors that can function in different environments, using the same concept does the wafer processing tools. Driving this segment global market growth is the growing demand for wafer-level sensor fabrication technologies as industries move towards intelligent automation and smart infrastructure.
By End Users
The computer segment dominated the wafer processing equipment market in 2024 with over 35% share, driven by ongoing advancements in computing technologies. Personal computers, data centers, and enterprise servers require powerful CPUs, GPUS, and specialized AI chips, all of which have been a boon for the wafer processing tools that produce these chips. However, they are an indispensable step in further miniaturising, enhancing performance, and power efficiency of modern computer hardware.
Asia Pacific Leads Wafer Processing Equipment Market with Strong Manufacturing Base, While North America Rises Rapidly on Back of CHIPS Act and Semiconductor Independence Drive
Asia Pacific emerged as the most dominant region in the wafer processing equipment market, commanding nearly 46.18% revenue share in 2024. This is mainly because a large number of semiconductor foundries and contract manufacturers are present in countries like Taiwan, South Korea, China, and Japan. These countries have steadily increased their investments in semiconductor manufacturing capacity in order to shift away from foreign supply, but also to meet the substantial global chip demand.
North America is set to experience significant growth, projected to record a CAGR of 6.89% from 2025 to 2032. Federal subsidies, centered on the CHIPS and Science Act, have driven a revival of domestic chip making in the U.S., with sophisticated fabs now being built in states like Arizona, Texas, and, as of recently, Ohio. All of which is making North America the heart of R&D for next-gen semiconductor manufacturing processes, thereby spurring wafer processing equipment demand in the region.
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